Company Filing History:
Years Active: 2009-2012
Title: Innovations by Inventor Hui-Ming Lin
Introduction: Hui-Ming Lin is a distinguished inventor based in Hsinchu, Taiwan, recognized for his contributions to the field of socket structure technology. With a total of two patents to his name, Lin's innovations focus on enhancing the efficiency and recycling capabilities of socket structures used in electronics.
Latest Patents: Hui-Ming Lin's most recent patents include "Socket Structure Stack and Socket Structure Thereof" and "Apparatus with Programmable Scan Chains for Multiple Chip Modules and Method for Programming the Same." The first patent introduces a socket structure stack that comprises at least two socket structures, each featuring a main body, conductive elements, and connecting elements. This innovative design allows for easy assembly and recycling of integrated circuits (ICs), processors, and printed circuit boards. Meanwhile, his second patent outlines an apparatus equipped with programmable scan chains, which greatly improves the selection and programming of multiple chip modules, enhancing the overall functionality of electronic devices.
Career Highlights: Over the course of his career, Hui-Ming Lin has made significant strides in the technology sector. He has worked with respected institutions such as the National Chip Implementation Center and the National Applied Research Laboratories, where he contributed to advancing chip design and implementation technology.
Collaborations: Lin has collaborated with notable colleagues such as Chun-Ming Huang and Chih-Chyau Yang, fostering a team-oriented approach to innovation. Their combined expertise has played a pivotal role in the development of cutting-edge technologies in the field.
Conclusion: Hui-Ming Lin stands out as a key figure in the field of socket structure technology. His patents not only demonstrate his innovative spirit but also contribute to the evolution of electronics, making him a prominent inventor in today's tech landscape. Lin's ongoing research and collaborations continue to inspire advancements in this essential industry.