The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2012
Filed:
Jul. 15, 2011
Chun-ming Huang, Hsinchu, TW;
Hui-ming Lin, Hsinchu, TW;
Chih-chyau Yang, Hsinchu, TW;
Chien-ming Wu, Hsinchu, TW;
Shih-lun Chen, Hsinchu, TW;
Chun-Ming Huang, Hsinchu, TW;
Hui-Ming Lin, Hsinchu, TW;
Chih-Chyau Yang, Hsinchu, TW;
Chien-Ming Wu, Hsinchu, TW;
Shih-Lun Chen, Hsinchu, TW;
National Chip Implementation Center, Hsinchu, TW;
National Applied Research Laboratories, Hsinchu, TW;
Abstract
A socket structure stack and a socket structure thereof are provided. The socket structure stack includes at least two socket structures, and each socket structure includes a main body, a plurality of conductive elements, and a plurality of connecting elements. The main body includes an inner plate and an outer plate, wherein the inner plate has a receiving portion and an embedded portion. The conductive elements are embedded in the embedded portion, and the connecting elements are mounted on the outer plate so as to connect adjacent socket structures together. The socket structures are so configured that ICs, processors, and printed circuit boards connected to the socket structures or the socket structures themselves can be recycled. Moreover, the printed circuit boards can be easily assembled to the socket structures, and the socket structures can be stacked up and securely connected to form a 3D structure which is otherwise difficult to put together by soldering.