Taipei, Taiwan

Hui-Feng Wu


Average Co-Inventor Count = 1.7

ph-index = 1

Forward Citations = 6(Granted Patents)


Location History:

  • Taipei Hsien, TW (2013)
  • New Taipei, TW (2017)

Company Filing History:


Years Active: 2013-2017

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2 patents (USPTO):Explore Patents

Title: Innovations by Hui-Feng Wu

Introduction

Hui-Feng Wu is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of data center technology, holding 2 patents that showcase his innovative approach to heat management and containerized data centers.

Latest Patents

One of his latest patents is a heat dissipating system for data centers. This system includes a return air area and an installation area, designed to efficiently manage airflow and humidity. The return air area features a return air damper and an air outlet, while the installation area includes an air inlet damper and an air outlet damper. The system is equipped with a fan control unit and a humidity control unit that regulates the airflow based on humidity levels, ensuring optimal conditions for electronic devices. Another significant patent is for a container data center, which comprises a mobile container, rails, supports, and a rack. This design allows for easy mobility and efficient space utilization, making it a practical solution for modern data center needs.

Career Highlights

Hui-Feng Wu is currently employed at Hon Hai Precision Industry Co., Ltd., a leading technology company known for its innovative manufacturing solutions. His work at the company has allowed him to develop and refine his inventions, contributing to advancements in data center technology.

Collaborations

He has collaborated with notable coworkers, including Hung-Chou Chan and Chih-Hung Chang, who have also contributed to the field of technology and innovation.

Conclusion

Hui-Feng Wu's contributions to data center technology through his patents reflect his commitment to innovation and efficiency. His work continues to influence the industry, paving the way for future advancements in technology.

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