Changchun, China

Hui Fan


Average Co-Inventor Count = 12.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2020

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1 patent (USPTO):Explore Patents

Title: Innovations by Hui Fan in Mechanical Properties Testing

Introduction

Hui Fan is an accomplished inventor based in Changchun, China. He has made significant contributions to the field of material testing, particularly through his innovative patent that addresses the in-situ testing of mechanical properties under various load conditions. His work is essential for advancing the understanding of material behavior in real-world applications.

Latest Patents

Hui Fan holds a patent titled "System and method for in-situ testing of mechanical properties of materials in static and dynamic load spectra." This system includes several subsystems, such as an Arcan biaxial clamping subsystem, a press-in test subsystem, a biaxial fatigue test subsystem, a biaxial pre-tension loading subsystem, a signal detection subsystem, and a support and adjustment subsystem. The design incorporates a combined guide mechanism that enhances the precision of testing, making it a valuable tool for researchers and engineers alike.

Career Highlights

Hui Fan is affiliated with Jilin University, where he continues to contribute to research and development in material science. His expertise in mechanical properties testing has positioned him as a key figure in his field. With a focus on practical applications, his innovations are paving the way for improved testing methodologies.

Collaborations

Hui Fan collaborates with notable colleagues, including Zhichao Ma and Hongwei Zhao. Their combined efforts in research and development foster a collaborative environment that enhances the quality and impact of their work.

Conclusion

Hui Fan's contributions to the field of mechanical properties testing are noteworthy and reflect his dedication to innovation. His patent serves as a testament to his expertise and commitment to advancing material science.

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