Taoyuan, Taiwan

Hui-Chun Wu

This inventor holds 1 USPTO granted patent. Top assignee: Darfon Electronics Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hui-Chun Wu. Retrieved from https://idiyas.com/inventor/hui-chun-wu-j0zrqi3e

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Hui-Chun Wu: Innovator in Touchpad Technology

Introduction

Hui-Chun Wu is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of touchpad technology, particularly with his innovative designs that enhance user interaction with devices.

Latest Patents

Hui-Chun Wu holds a patent for a "Touchpad device having bracket of integral dual-layered one-piece structure." This invention features a touchpad that is capable of sensing touch operations, supported by a uniquely designed bracket. The bracket includes multiple sets of limiting structures, with two interfering members that extend from it, allowing for an efficient stacking configuration.

Career Highlights

Wu is currently employed at Darfon Electronics Corporation, where he continues to develop cutting-edge technologies in the electronics sector. His work focuses on improving user interfaces and enhancing the functionality of touch-sensitive devices.

Collaborations

Hui-Chun Wu collaborates with Ting-Yi Chu, a fellow innovator in the field. Together, they work on advancing touchpad technology and exploring new applications for their inventions.

Conclusion

Hui-Chun Wu's contributions to touchpad technology exemplify his commitment to innovation and excellence in the electronics industry. His patent and ongoing work at Darfon Electronics Corporation highlight his role as a key player in the development of user-friendly technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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