Hui-Chi Su

Title: Innovations of Hui-Chi Su

Introduction

Hui-Chi Su is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of microelectronics, particularly through his innovative patents. With a total of 2 patents, his work showcases advancements in infrared devices and micro fabrication techniques.

Latest Patents

Hui-Chi Su's latest patents include an "Infrared device and method for manufacturing the same." This patent describes an infrared device that consists of a substrate, a metal layer, a first semiconductor layer, an absorber layer, and a second semiconductor layer. The design features a cavity formed between the first semiconductor layer and the metal layer, with the absorber layer positioned on the first semiconductor layer. Notably, the temperature coefficient of resistance (TCR) of the first semiconductor layer differs from that of the second semiconductor layer.

Another significant patent is for "Micro fabrication with vortex shaped spirally topographically tapered spirally patterned conductor layer and method for fabrication thereof." This invention involves a spirally patterned conductor layer that is topographically tapered in a vortex shape, which is particularly useful as a microelectronic inductor structure within microelectronic fabrication.

Career Highlights

Hui-Chi Su is affiliated with the Industrial Technology Research Institute, where he continues to push the boundaries of technology and innovation. His work has been instrumental in advancing the capabilities of microelectronic devices.

Collaborations

Hui-Chi Su collaborates with talented individuals such as Wei-Su Chen and Yi-Shian Chen, contributing to a dynamic research environment that fosters innovation.

Conclusion

Hui-Chi Su's contributions to the field of microelectronics through his patents reflect his dedication to innovation and technology. His work continues to influence advancements in infrared devices and micro fabrication techniques.