Company Filing History:
Years Active: 2002-2003
Title: Hugh Li - Innovator in Bonding Technologies
Introduction
Hugh Li is a notable inventor based in Santa Clara, CA, who has made significant contributions to the field of bonding technologies. With a total of 2 patents, he has developed innovative methods that enhance the performance and reliability of bonding processes in semiconductor manufacturing.
Latest Patents
Hugh Li's latest patents include a method for improving bond pad and wire bonding techniques. The first patent describes a method that involves removing an oxide from a surface and commencing the application of a passivation layer within 5 seconds of the oxide removal. This method is particularly applicable to copper surfaces, which may include bonding pad surfaces. The oxide removal process can utilize solutions containing citric acid or hydrochloric acid. Furthermore, the application of the passivation layer may involve solutions from the azole family, including BTA. The complete application of the passivation layer is designed to occur within 35 seconds after its initial application. The second patent focuses on enabling conventional wire bonding to copper-based bond pad features, employing similar techniques to those outlined in the first patent.
Career Highlights
Hugh Li is currently employed at Lam Research Corporation, a leading company in the semiconductor equipment industry. His work at Lam Research has allowed him to apply his innovative ideas and contribute to advancements in bonding technologies.
Collaborations
Hugh collaborates with Diane J Hymes, a coworker who shares his commitment to innovation in the field.
Conclusion
Hugh Li's contributions to bonding technologies through his patents reflect his dedication to advancing semiconductor manufacturing processes. His innovative methods are poised to make a lasting impact in the industry.