Taipei, Taiwan

Huei-Chuen Tseng

This inventor holds 1 USPTO granted patent. Top assignee: Giant Glory International Limited. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Huei-Chuen Tseng. Retrieved from https://idiyas.com/inventor/huei-chuen-tseng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2025

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Innovations by Huei-Chuen Tseng

Introduction

Huei-Chuen Tseng is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of manufacturing through his innovative methods. His work focuses on creating efficient processes that enhance product quality and functionality.

Latest Patents

Huei-Chuen Tseng holds a patent for a "Method for producing outer shell." This method involves several steps, including stacking plates and disposing of a filling material to create a composite structure. The process is designed to ensure that the filling material's weight is lower than that of the surrounding plates, or that its rigidity is higher, resulting in a durable outer shell.

Career Highlights

Tseng is associated with Giant Glory International Limited, where he applies his expertise in product development. His innovative approach has led to advancements in manufacturing techniques, making him a valuable asset to his company.

Collaborations

Some of his coworkers include Cheng-Ping Hsiao and Yi-Feng Huang, who contribute to the collaborative environment that fosters innovation within their team.

Conclusion

Huei-Chuen Tseng's contributions to the field of manufacturing through his patented methods exemplify the spirit of innovation. His work continues to influence the industry and inspire future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…