This inventor holds 1 USPTO granted patent, plus 1 CIPO patent and 1 EPO patent. Top assignee: Ballard Power Systems Corporation. Active years: 2004.
Company Filing History:
Years Active: 2004
Title: The Innovative Contributions of Hubert Ryssel
Introduction
Hubert Ryssel is a notable inventor based in Esslingen, Germany. He has made significant contributions to the field of electrochemical cell technology. His innovative approach has led to the development of a unique patent that enhances the bonding and sealing of electrochemical cell elements.
Latest Patents
Ryssel holds a patent for "Systems, apparatus and methods for bonding and/or sealing electrochemical cell elements and assemblies." This invention focuses on an apparatus, systems, and methods for bonding one element of an electrochemical cell or cell stack to another. The design features a sealing groove with a complex cross-sectional shape that receives and retains a bead of adhesive prior to assembly. The complex shape includes a raised portion to hold the adhesive and at least one depressed portion to accommodate any adhesive displaced during assembly. The invention incorporates various raised portions with straight, beveled, curved, and rough surfaces to enhance the bond strength between the elements. He has 1 patent to his name.
Career Highlights
Throughout his career, Hubert Ryssel has worked with several prominent companies in the industry. Notably, he has been associated with Ballard Power Systems Corporation and BDF IP Holdings Ltd. His work in these organizations has allowed him to apply his innovative ideas and contribute to advancements in electrochemical technologies.
Collaborations
Ryssel has collaborated with talented individuals in his field, including Johann Einhart and Stefan Reiff. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.
Conclusion
Hubert Ryssel's contributions to the field of electrochemical cell technology are noteworthy. His innovative patent and collaborations with industry professionals highlight his commitment to advancing technology. His work continues to influence the development of efficient bonding and sealing methods in electrochemical applications.