This inventor holds 1 USPTO granted patent. Top assignee: Guangzhou Tech-Long Packaging Machinery Co., Ltd. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Huatian Mai: Innovator in Packaging Technology
Introduction
Huatian Mai is a notable inventor based in Guangdong, China. He has made significant contributions to the field of packaging technology, particularly through his innovative designs and methods.
Latest Patents
Huatian Mai holds a patent for a "Bare bottle pre-grouping and stacking device, stacking method and packaging apparatus." This invention includes a bottle feeding and conveying mechanism, a grouping and conveying mechanism, a stacking and conveying mechanism, and a pre-grouping mechanism. The bottle feeding and conveying mechanism is designed to transport multiple columns of bare bottles. The grouping and conveying mechanism is positioned downstream of the bottle feeding and conveying mechanism. The stacking and conveying mechanism is located at the outlet end of the grouping and conveying mechanism and shares the same conveying direction. The pre-grouping mechanism features a mechanical arm and a pre-grouping clamp, enhancing the efficiency of the packaging process.
Career Highlights
Huatian Mai is associated with Guangzhou Tech-Long Packaging Machinery Co., Ltd., where he applies his expertise in packaging solutions. His work has been instrumental in advancing the technology used in the packaging industry.
Collaborations
Huatian Mai collaborates with talented individuals such as Jianbao Deng and Ling Deng, contributing to innovative projects and enhancing the capabilities of their team.
Conclusion
Huatian Mai's contributions to packaging technology through his patent and work at Guangzhou Tech-Long Packaging Machinery Co., Ltd. highlight his role as an influential inventor in the industry. His innovative solutions continue to shape the future of packaging processes.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile