Taipei, Taiwan

Huang-Pin Shen

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Asia Vital Components Co., Ltd.. Active years: 2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Huang-Pin Shen. Retrieved from https://idiyas.com/inventor/huang-pin-shen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: Huang-Pin Shen and Heat Dissipation Innovation.

Introduction

Huang-Pin Shen is an inventor associated with Taipei, Taiwan, and Asia Vital Components Co., Ltd. His patent work includes a heat dissipation device designed to improve heat transfer and cooling performance.

Latest Patents

The supplied information identifies one patent for Shen: “Heat dissipation device.” The invention combines a covering member, a heat pipe, and a heat dissipation unit. The covering member has a hollow, C-shaped fitting portion that holds the heat pipe, along with at least one outwardly extending heat transfer portion. The heat dissipation unit contains parallel, spaced heat radiation fins with through holes and locating slots. The fitting portion and heat transfer portion pass through these openings to connect the covering member to the fin assembly. The design aims to enhance heat transfer and dissipation. Shen’s listed patent count is 1 patent.

Career Highlights

Shen’s documented patent activity concerns thermal management hardware. His work at Asia Vital Components Co., Ltd. connects his invention to a company focused on component technologies.

Collaborations

Chih-Peng Chen is identified as Shen’s coworker. The supplied information does not specify whether Chen collaborated on the heat dissipation device patent.

Conclusion

Huang-Pin Shen’s listed invention addresses heat dissipation through a connected heat pipe, covering member, and fin assembly, with a design intended to improve thermal performance.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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