Beijing, China

Huancheng Bai

This inventor holds 1 USPTO granted patent. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Huancheng Bai. Retrieved from https://idiyas.com/inventor/huancheng-bai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 1.0

ph-index = 1


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Innovations by Huancheng Bai in Collage Making Technology.

Introduction

Huancheng Bai is an innovative inventor based in Beijing, China. He has made significant contributions to the field of electronic devices and methods for collage making. His work focuses on enhancing the user experience in creating collages through advanced technology.

Latest Patents

Huancheng Bai holds a patent for a "Method, apparatus, electronic device and readable medium for collage making." This invention discloses methods and an electronic device designed specifically for collage creation. The method involves determining a collage template and a set of image blocks, sending invitations for collaboration, and obtaining cooperative collage data to produce a final collage result.

Career Highlights

Throughout his career, Huancheng Bai has demonstrated a commitment to innovation in technology. His patent reflects his ability to integrate user-friendly features with advanced electronic capabilities. This invention not only simplifies the collage-making process but also encourages collaboration among users.

Collaborations

Huancheng Bai has worked alongside talented individuals such as Lishu Luo and Yuchen Lian. Their collaborative efforts have contributed to the development of innovative solutions in the field of electronic devices.

Conclusion

Huancheng Bai's contributions to collage making technology highlight his innovative spirit and dedication to enhancing user experiences. His patent serves as a testament to his creativity and technical expertise in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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