Taipei, Taiwan

Huan-Yang Yeh

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Compal Electronics, Inc.. Active years: 2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Huan-Yang Yeh. Retrieved from https://idiyas.com/inventor/huan-yang-yeh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 12.0

ph-index = 1


Company Filing History:


Years Active: 2021

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1 patent (USPTO):Explore Patents

Title: Huan-Yang Yeh and Fan Deformation Monitoring

Introduction

Huan-Yang Yeh is an inventor associated with Taipei, Taiwan, and Compal Electronics, Inc. His patent work addresses fan safety in electronic devices by monitoring deformation in a fan housing and controlling fan operation in response.

Latest Patents

Yeh is credited with 1 patent. His patent, “Electronic device having a deformation sensor on a fan module of a fan and using a controller to monitor the deformation sensor and control operation of the fan based on a deformation signal of the sensor,” describes an electronic device with a fan module and a deformation sensor inside its housing. When the sensor detects that the fan housing has deformed, it sends a signal to a controller, which stops the fan blade. This approach links structural monitoring to automatic fan control.

Career Highlights

Yeh’s documented invention focuses on integrating a deformation sensor and controller into an electronic device’s fan system. The design is intended to respond to fan-housing deformation by stopping the fan.

Collaborations

Yeh’s listed coworkers include Tse-Yang Lin and Hao-Wu Yang. His work is associated with Compal Electronics, Inc.

Conclusion

Huan-Yang Yeh’s patent describes a practical safety mechanism that detects fan-housing deformation and stops the fan in response.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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