Anhui, China

Huan Qi

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Tcl Home Appliances (Hefei) Co Ltd.. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Huan Qi. Retrieved from https://idiyas.com/inventor/huan-qi-l2rusj1n

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

 

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Huan Qi and a Washing Machine Assembly Innovation.

Introduction

Huan Qi is an inventor associated with Anhui, China, and Tcl Home Appliances (Hefei) Co Ltd. His patent work includes a washing machine assembly that integrates ultrasound technology into the appliance’s door assembly.

Latest Patents

The provided information identifies one patent for Huan Qi: 1 patent, titled “Washing machine assembly.” The invention describes a body connected to an outer drum, which contains an accommodating container and an open groove. An inner drum sits within the container and forms the washing tank. A rotating door assembly covers the outer drum’s open groove, and an ultrasound apparatus is mounted in the door assembly, extending at least partially into the washing tank.

Career Highlights

Qi’s listed patent reflects work on incorporating an ultrasound apparatus into a washing machine’s structure. The design places the apparatus in the door assembly while positioning at least part of it inside the washing tank.

Collaborations

The provided information lists Benyang Bian and Wenjie Zhang as Qi’s coworkers. The patent is associated with Tcl Home Appliances (Hefei) Co Ltd.

Conclusion

Huan Qi’s washing machine assembly patent describes an appliance design that integrates ultrasound technology with the door and washing tank, highlighting his contribution to washing machine innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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