Chengdu, China

Huaigang Zhang

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignees: Diodes Inc., Diodes Technology (Chengdu) Company Limited, Shanghai Kaihong Electronic Company Limited. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Huaigang Zhang. Retrieved from https://idiyas.com/inventor/huaigang-zhang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Huaigang Zhang: Inventor of a Heat-Insulating Connector for Wire Bonders.

Introduction

Huaigang Zhang is an inventor associated with Chengdu, China. His work includes an invention designed to reduce heat transfer in a wire bonder’s gas-pipe connection. Zhang is associated with Shanghai Kaihong Electronic Company Limited and Diodes Technology (Chengdu) Company Limited.

Latest Patents

Zhang is credited with 1 patent: “Wire Bonder and Gas Pipe Connector Therefor.” The invention describes a connector with one end attached to the wire bonder’s heating component and another connected to a gas pipe. A heat-insulation tube between the ends is designed to insulate or reduce heat transfer. The connector may also use fastening sleeves to secure the tube at both connections.

Career Highlights

Zhang’s patent reflects a focus on a practical component of wire-bonding equipment: managing heat transfer between a heating component and a gas pipe. His professional associations include Shanghai Kaihong Electronic Company Limited and Diodes Technology (Chengdu) Company Limited.

Collaborations

Zhang’s listed coworker is Chris Wang. His work and company associations connect his inventive activity with electronics and technology organizations.

Conclusion

Huaigang Zhang’s patent presents a heat-insulating connector intended to improve thermal separation in wire-bonder equipment, highlighting his contribution to electronics-related engineering.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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