Company Filing History:
Years Active: 2023
Title: Huaguang Wang: Innovator in Lead-Free Solder Technology
Introduction
Huaguang Wang is a notable inventor based in New Hartford, NY (US). He has made significant contributions to the field of solder technology, particularly with his innovative approach to lead-free solder paste.
Latest Patents
Wang holds a patent for a lead-free solder paste with mixed solder powders designed for high-temperature applications. This patent, which is particularly suitable for multiple board-level reflow operations, outlines a solder paste that consists of 10 wt % to 90 wt % of a first solder alloy powder, which is an SnSbCuAg solder alloy with a weight ratio of Sn:Sb ranging from 0.75 to 1.1. Additionally, it includes 10 wt % to 90 wt % of a second solder alloy powder, which is an Sn solder alloy containing at least 80 wt % of Sn, along with a remainder of flux.
Career Highlights
Wang is currently employed at Indium Corporation, where he continues to develop and refine solder technologies. His work has been instrumental in advancing the capabilities of lead-free soldering solutions.
Collaborations
Wang collaborates with talented coworkers, including Hongwen Zhang and Samuel Lytwynec, who contribute to the innovative environment at Indium Corporation.
Conclusion
Huaguang Wang's contributions to lead-free solder technology exemplify his commitment to innovation in the field. His patent for a specialized solder paste highlights the importance of developing environmentally friendly solutions for high-temperature applications.