This inventor holds 2 USPTO granted patents and 12 published patent applications. Top assignee: Saint-Gobain Ceramics & Plastics, Inc.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Hua Wang: Innovator in High Thermal Conductivity Composites
Introduction
Hua Wang is a notable inventor based in Northbridge, MA (US), recognized for his contributions to the field of composite materials. With a focus on enhancing thermal conductivity, he has developed innovative solutions that have significant applications in various industries. His work has led to the issuance of two patents, showcasing his expertise and commitment to advancing material science.
Latest Patents
Hua Wang's latest patents include a composite body having high thermal conductivity and a method of making the composite body. The first patent describes a composite article that comprises an organic polymer and ceramic particles, specifically hexagonal boron nitride (hBN) particles. These particles are distributed throughout the organic polymer, with their volume ranging from 20 vol % to 40 vol % based on the total volume of the body. This composite body achieves an in-plane thermal conductivity of at least 10 W/mK, with the hBN particles exhibiting a March-Dollase Orientation parameter η of at least 50%. The second patent further enhances this concept, detailing a composite body with hBN particles ranging from 40 vol % to 90 vol %, achieving an in-plane thermal conductivity of at least 15 W/mK, while maintaining the same orientation parameter.
Career Highlights
Hua Wang is currently employed at Saint-Gobain Ceramics & Plastics, Inc., where he continues to innovate in the field of composite materials. His work at this esteemed company has allowed him to explore new methodologies and applications for high thermal conductivity composites.
Collaborations
Hua Wang has collaborated with several talented individuals in his field, including Chuanping Li and Daniel Shrives. These collaborations have fostered a creative environment that encourages the exchange of ideas and advancements in material science.
Conclusion
Hua Wang's contributions to the development of high thermal conductivity composites position him as a significant figure in material innovation. His patents reflect a deep understanding of composite materials and their potential applications, paving the way for future advancements in the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
