New Taipei, Taiwan

Hua-Feng Hsieh

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Acer Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hua-Feng Hsieh. Retrieved from https://idiyas.com/inventor/hua-feng-hsieh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Hua-Feng Hsieh and His Foldable Electronic Device Patent.

Introduction

Hua-Feng Hsieh is an inventor associated with Acer Inc. in New Taipei, Taiwan. His patent work includes an invention for a foldable electronic device designed to operate across a wide range of folding positions.

Latest Patents

Hsieh is credited with 1 patent. His patent, “Foldable Electronic Device,” describes a device with two bodies connected by a hinge, allowing them to rotate between folded and unfolded positions, including 0-degree and 360-degree states.

The design uses magnets in the first body and a carrier, along with a counterweight wheel pivoted to the second body. The wheel’s pivot is offset from its center of gravity, enabling gravity to rotate it in response to the second body’s posture. An end of the wheel connects to the carrier, coordinating the mechanism’s movement.

Career Highlights

Hsieh’s documented patent contribution focuses on foldable-device mechanics. The invention addresses how components can respond to changes in a device’s orientation as its bodies rotate.

Collaborations

The patent information associates Hsieh with Acer Inc. The available details do not specify additional collaborators.

Conclusion

Hua-Feng Hsieh’s patent describes a gravity-responsive mechanism for a foldable electronic device, reflecting his contribution to Acer’s work on foldable-device design.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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