This inventor holds 1 USPTO granted patent. Top assignee: Nokia Solutions and Networks Oy. Active years: 2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2025
Title: Innovations by Hua Cai in Heat Dissipation Technology
Introduction
Hua Cai is a notable inventor based in Jiangsu, China. He has made significant contributions to the field of heat dissipation technology, particularly through his innovative designs that enhance the efficiency of electrical devices. His work is recognized for its practical applications in modern technology.
Latest Patents
Hua Cai holds a patent for a heat dissipation component and associated electrical device. This innovative component includes a heat conductor that is attached to a pluggable module or a heat sink associated with an interface of an electrical device. The design is configured to conduct heat from the pluggable module to the heat sink. The heat conductor features a heat input section that is in thermal contact with the pluggable module and a heat output section that is in thermal contact with the heat sink. Additionally, an elastic assembly is coupled to the heat conductor, which applies biasing forces to ensure optimal thermal contact when the pluggable module is connected to the interface. This patent showcases his inventive approach to improving thermal management in electronic devices, with a total of 1 patent.
Career Highlights
Hua Cai is currently employed at Nokia Solutions and Networks Oy, where he continues to develop innovative solutions in the field of technology. His work at Nokia has allowed him to collaborate with other talented professionals and contribute to cutting-edge projects that push the boundaries of electrical engineering.
Collaborations
One of his notable coworkers is Yan Xia, with whom he has likely shared insights and expertise in their respective fields. Their collaboration may have further enhanced the innovative capabilities within their projects.
Conclusion
Hua Cai's contributions to heat dissipation technology exemplify the importance of innovation in enhancing the performance of electrical devices. His patent reflects a commitment to improving thermal management solutions, which are crucial in today's technology-driven world.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile