Company Filing History:
Years Active: 2024
Title: Hsiu-Ju Yang: Innovator in Semiconductor Packaging
Introduction
Hsiu-Ju Yang is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging, showcasing his innovative spirit through his patented designs. His work is particularly relevant in the ever-evolving technology landscape.
Latest Patents
Hsiu-Ju Yang holds a patent for a unique package structure. This package structure includes a substrate with a first surface, a semiconductor chip positioned on that surface, and a support that surrounds the semiconductor chip. The support comprises an electrical conducting member that penetrates through it. Additionally, an optical component is placed on the support and is electrically connected to the substrate via the electrical conducting member. This invention highlights Yang's commitment to advancing semiconductor technology.
Career Highlights
Hsiu-Ju Yang is currently associated with Ireach Corporation, where he continues to innovate and develop new technologies. His work at the company has positioned him as a key player in the semiconductor industry.
Collaborations
Some of his coworkers include Shou-Lung Chen and Hsin-Chan Chung, who contribute to the collaborative environment that fosters innovation at Ireach Corporation.
Conclusion
Hsiu-Ju Yang's contributions to semiconductor packaging through his patent demonstrate his innovative capabilities and commitment to advancing technology. His work continues to influence the industry and inspire future innovations.