The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2024
Filed:
Mar. 02, 2021
Applicant:
Ireach Corporation, Hsinchu County, TW;
Inventors:
Assignee:
iReach Corporation, Hsinchu County, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/042 (2006.01); H01L 33/48 (2010.01); H01L 33/54 (2010.01); H01L 33/62 (2010.01); H01S 5/02257 (2021.01); H01L 33/58 (2010.01); H01S 5/02208 (2021.01); H01S 5/02234 (2021.01); H01S 5/068 (2006.01); H01S 5/183 (2006.01); H01S 5/00 (2006.01);
U.S. Cl.
CPC ...
H01S 5/042 (2013.01); H01L 33/486 (2013.01); H01L 33/54 (2013.01); H01L 33/62 (2013.01); H01S 5/0014 (2013.01); H01S 5/02257 (2021.01); H01L 33/58 (2013.01); H01L 2933/005 (2013.01);
Abstract
A package structure includes: a substrate includes a first surface; a semiconductor chip disposed on the first surface; a support disposed on the first surface and surrounding the semiconductor chip comprises an electrical conducting member and penetrating the support; and an optical component disposed on the support and electrically connected to the substrate by the electrical conducting member.