Company Filing History:
Years Active: 2020-2025
Title: Hsing-Wen Lee: Innovator in Semiconductor Technology
Introduction
Hsing-Wen Lee is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of three patents. His work focuses on innovative methods and structures that enhance semiconductor packaging.
Latest Patents
Hsing-Wen Lee's latest patents include a semiconductor package and a method of manufacturing the same. The patent describes a semiconductor substrate that features a first dielectric layer with both a first and second surface. It includes a first conductive via that extends between these surfaces, along with a first patterned conductive layer on the first surface and a second patterned conductive layer on the second surface. The design incorporates a bottom pattern with at least two geometric centers corresponding to two geometric patterns. The distance between one geometric center and the intersection of the two patterns is defined as a geometric radius, and the distance between the geometric centers exceeds 1.4 times this radius. This innovative approach aims to improve the efficiency and performance of semiconductor packages.
Career Highlights
Hsing-Wen Lee is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to develop cutting-edge semiconductor technologies. His expertise in the field has positioned him as a key player in advancing semiconductor manufacturing processes.
Collaborations
Hsing-Wen Lee collaborates with notable colleagues, including Sheng-Ming Wang and Tien-Szu Chen, who contribute to the innovative projects at Advanced Semiconductor Engineering, Inc.
Conclusion
Hsing-Wen Lee's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His work continues to pave the way for advancements in semiconductor packaging and manufacturing.