Company Filing History:
Years Active: 2013
Title: Hsing Hung - Innovator in Thermal Conduction Technology.
Introduction
Hsing Hung is a notable inventor based in Taipei County, Taiwan. He has made significant contributions to the field of thermal conduction technology, particularly through his innovative patent.
Latest Patents
Hsing Hung holds a patent for a thermal conduction device and a method for fabricating the same. This invention involves arranging a plurality of diamond particles on a plane to form a diamond particle monolayer. The process includes applying a forming technique on a metal material, resulting in a composite body that embeds the diamond particles within a metal matrix. By stacking multiple composite bodies and performing a heating process, the metal matrixes are joined to create a highly efficient thermal conduction device. This device is characterized by its two-dimensional monolayer structure, which is assembled into a three-dimensional multilayer structure, enhancing its thermal conduction performance.
Career Highlights
Hsing Hung is associated with Ritedia Corporation, where he continues to develop and innovate in the field of thermal conduction. His work has positioned him as a key figure in advancing thermal management technologies.
Collaborations
Hsing Hung has collaborated with notable colleagues, including Shao-Chung Hu and Hung-Cheng Lin, contributing to various projects and innovations within the company.
Conclusion
Hsing Hung's contributions to thermal conduction technology exemplify the impact of innovative thinking in engineering. His patent reflects a significant advancement in the field, showcasing the potential for improved thermal management solutions.