The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2013
Filed:
Jan. 11, 2011
Shao-chung HU, Taipei County, TW;
Hsing Hung, Taipei County, TW;
Hung-cheng Lin, Taipei County, TW;
I-chiao Lin, Taipei, TW;
Chien-min Sung, Taipei County, TW;
Shao-Chung Hu, Taipei County, TW;
Hsing Hung, Taipei County, TW;
Hung-Cheng Lin, Taipei County, TW;
I-Chiao Lin, Taipei, TW;
Chien-Min Sung, Taipei County, TW;
Ritedia Corporation, Hsinchu, TW;
Abstract
A thermal conduction device and a method for fabricating the same are disclosed. Firstly, arrange a plurality of diamond particles on a plane according to a predetermined pattern to form a diamond particle monolayer. Next, apply a forming process on a metal material such that the metal material forms a metal matrix wrapping the diamond particles to form a composite body including the diamond particle monolayer embedded in the metal matrix. Next, stack a plurality of the composite bodies and perform a heating process to join the metal matrixes to each other to form the thermal conduction device. The device is characterized in arranging diamond particles on a plane to form a two-dimensional monolayer structure and manufactured via assembling the two-dimensional monolayer structures to form a three-dimensional multilayer structure. By controlling the arrangement of the diamond particles, the thermal conduction device can have superior thermal conduction performance.