Taipei, Taiwan

Hsing-Feng Tsai

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Giga-Byte Technology Co., Ltd.. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hsing-Feng Tsai. Retrieved from https://idiyas.com/inventor/hsing-feng-tsai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Hsing-Feng Tsai: Innovator in Clamping Technology

Introduction

Hsing-Feng Tsai is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of clamping technology, particularly in the design of devices that enhance the functionality of memory modules.

Latest Patents

Hsing-Feng Tsai holds a patent for a clamping module and clamping system. This innovative clamping module is designed to securely hold a memory module and facilitate its insertion or removal from a slot. The clamping module consists of a main body, two jaw clamps, and a blocking pressing plate. The jaw clamps are movable and work in tandem to either clamp or release the memory module. Once the memory module is positioned correctly, the blocking pressing plate moves to ensure the module is securely inserted into the slot.

Career Highlights

Hsing-Feng Tsai is currently employed at Giga-byte Technology Co., Ltd., where he continues to develop cutting-edge technologies. His work has been instrumental in advancing the efficiency and reliability of memory module systems.

Collaborations

He collaborates with talented coworkers, including Yen-Yun Chang and Tsung-Ta Wu, who contribute to the innovative environment at Giga-byte Technology Co., Ltd.

Conclusion

Hsing-Feng Tsai's contributions to clamping technology exemplify his commitment to innovation and excellence in the field. His patent for the clamping module showcases his ability to solve complex engineering challenges.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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