Hsing-Chou Hsu is a notable inventor based in Hsin-Tien, Taiwan. He has made significant contributions to the field of wiring board technology, holding a total of 5 patents. His innovative designs have advanced the functionality and efficiency of electronic components.

Latest Patents

Hsu's latest patents include an "Arrangement of non-signal through vias and wiring board applying the same." This invention provides a unique arrangement of non-signal through vias suitable for a wiring board, enhancing the electrical connections between contact pads. Another significant patent is the "Plunger and chip-testing module applying the same." This invention features a plunger designed for a chip-testing module, which includes a probe card with a circuit board and a membrane, improving the testing process for electronic components.

Career Highlights

Hsing-Chou Hsu works at Via Technologies, Inc., where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of wiring boards and chip-testing modules, making him a key figure in the industry.

Collaborations

Hsu collaborates with talented individuals such as Chi-Hsing Hsu and Hsin-Kuan Wu, who contribute to the innovative environment at Via Technologies, Inc. Their teamwork fosters creativity and leads to groundbreaking advancements in technology.

Conclusion

Hsing-Chou Hsu's contributions to wiring board technology and chip-testing modules highlight his role as a leading inventor in the field. His patents reflect a commitment to innovation and excellence in electronic design.

This text is generated by artificial intelligence and may not be accurate.

Please report any incorrect information to support@idiyas.com