Hsin-Ta Lin

Title: Hsin-Ta Lin: Innovator in Substrate Structures

Introduction

Hsin-Ta Lin is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of substrate structures, holding a total of three patents. His work focuses on enhancing the functionality and efficiency of electronic components.

Latest Patents

Hsin-Ta Lin's latest patents include innovative methods for fabricating substrate structures. One of his patents describes a substrate structure that features a substrate body with multiple conductive pads, an insulating layer, conductive vias, circuits, and conductive posts. This design allows for micro-chips or fine-pitch conductive pads to be electrically connected to the substrate structure in a flip-chip manner. Another patent outlines a similar substrate structure with an emphasis on the integrally formed conductive vias, circuits, and posts, further enhancing the electrical connectivity of electronic components.

Career Highlights

Hsin-Ta Lin is currently employed at Siliconware Precision Industries Co., Ltd., where he continues to develop cutting-edge technologies in substrate fabrication. His expertise in this area has positioned him as a key player in the advancement of electronic manufacturing processes.

Collaborations

Hsin-Ta Lin collaborates with talented coworkers, including Ching-Wen Chiang and Cheng-Chia Chiang. Their combined efforts contribute to the innovative projects at Siliconware Precision Industries Co., Ltd.

Conclusion

Hsin-Ta Lin's contributions to substrate structures and his innovative patents reflect his dedication to advancing technology in the electronics industry. His work continues to influence the development of efficient electronic components.