Hong Kong, China

Hsin Min Chung

This inventor holds 1 USPTO granted patent. Top assignee: Reebok International Limited. Active years: 2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hsin Min Chung. Retrieved from https://idiyas.com/inventor/hsin-min-chung

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 10(Granted Patents)


Company Filing History:


Years Active: 2014

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1 patent (USPTO):Explore Patents

Title: Hsin Min Chung: Innovator in Performance Apparel

Introduction

Hsin Min Chung is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of athletic garments, focusing on enhancing performance through innovative design.

Latest Patents

Hsin Min Chung holds 1 patent for his invention titled "Performance apparel with flexible portion." This patent describes athletic garments that include a base layer with a front and back surface. The garment features a first flexible layer on both surfaces, which has a lattice pattern formed by a plurality of voids. Additionally, a second flexible layer is also applied to both surfaces, creating a second lattice pattern.

Career Highlights

Chung is currently employed at Reebok International Limited, where he continues to develop innovative solutions in performance apparel. His work focuses on integrating flexibility and comfort into athletic wear, which is essential for enhancing athletic performance.

Collaborations

Some of his coworkers include Anna E Newton and Hongqing Shen, who contribute to the collaborative environment at Reebok International Limited.

Conclusion

Hsin Min Chung's innovative approach to performance apparel exemplifies the intersection of technology and athleticism. His contributions are paving the way for advancements in the field of sportswear.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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