This inventor holds 1 USPTO granted patent and 12 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Hsin Liang Chen - Innovator in Semiconductor Packaging
Introduction
Hsin Liang Chen is an inventor based in New Taipei City, Taiwan. He is known for his contributions to the field of semiconductor packaging. Although he currently holds no granted patents, his innovative ideas are reflected in his latest patent applications.
Latest Patent Applications
Hsin Liang Chen has submitted several notable patent applications. One of his applications is titled "BONDING SCHEME FOR SEMICONDUCTOR PACKAGING." This method involves forming a device region along a first substrate, creating an interconnect structure, and developing a metal pillar with multiple layers. The process also includes forming a solder region and performing an etch process to refine the structure. Another application is "INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME." This invention describes a device that includes an interposer, a package substrate, and conductive connectors with unique configurations. The design aims to enhance the bonding between the package substrate and the interposer.
Conclusion
Hsin Liang Chen is an emerging inventor in the semiconductor field, with innovative patent applications that showcase his expertise and creativity. His work has the potential to influence future developments in semiconductor packaging technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile