Company Filing History:
Years Active: 2000
Title: Hsin-Hsing Wei: Innovator in Semiconductor Packaging
Introduction
Hsin-Hsing Wei is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative designs and patents.
Latest Patents
Hsin-Hsing Wei holds a patent for a semiconductor package that features a heat spreader capable of preventing overheating. This semiconductor package includes a die and multiple leads that are electrically connected to the die using bonding wires. The heat spreader is designed with an upper face that is thermally contacted with the die. It is constructed from a copper core, which has a surface that is sequentially coated with a metal medium layer and an insulation layer. The metal medium layer exhibits a higher adhesion degree with the insulation material compared to copper. The package body encapsulates the die, heat spreader, and leads, ensuring efficient thermal management.
Career Highlights
Hsin-Hsing Wei is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to develop innovative solutions in semiconductor technology. His work has been instrumental in advancing the efficiency and reliability of semiconductor packages.
Collaborations
Hsin-Hsing Wei collaborates with talented colleagues, including Su Tao and Kuang-Lin Lo, who contribute to the innovative environment at Advanced Semiconductor Engineering, Inc.
Conclusion
Hsin-Hsing Wei's contributions to semiconductor packaging highlight his role as an influential inventor in the industry. His innovative designs and patents continue to shape the future of semiconductor technology.