This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Industrial Technology Research Institute. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Hsien-Wei Chiu: Innovator in Circuit Substrate Technology
Introduction
Hsien-Wei Chiu is an inventor based in Taoyuan, Taiwan. He is known for his contributions to circuit substrate technology. Although he currently holds no granted patents, his innovative ideas are reflected in his latest patent applications.
Latest Patent Applications
One of Hsien-Wei Chiu's latest patent applications is titled "CIRCUIT SUBSTRATE AND METHOD FOR FABRICATING THE SAME." This application describes a circuit substrate that includes a glass substrate, a conductive post, and a dielectric layer. The glass substrate features a through hole, with the conductive post located within this hole. The dielectric layer is also situated in the through hole, ensuring that the conductive post is separated from the glass substrate by the dielectric layer.
Another significant application is for a "HYBRID BONDING STRUCTURE AND DISPLAY PANEL." This application outlines a bonding structure that consists of a first dielectric layer, multiple first conductors, a second dielectric layer, and multiple second conductors. The first conductors are embedded in the first dielectric layer, which is bonded with the second dielectric layer. The second conductors are embedded in the second dielectric layer, and the bonding interface between the first and second conductors contains silver.
Conclusion
Hsien-Wei Chiu is an innovative inventor whose work in circuit substrate technology shows promise for future advancements. His latest patent applications highlight his commitment to developing new solutions in this field.