Company Filing History:
Years Active: 2001
Title: Hsien-Sheng Pei: Innovator in Heat Dissipation Technology
Introduction: Hsien-Sheng Pei, based in Taipei, Taiwan, stands as an inventive mind in the realm of thermal management solutions. He holds a notable patent that showcases his ingenuity in creating efficient heat dissipating devices, a vital component in various electronic applications.
Latest Patents: Pei's single patent, titled “Heat dissipating device and method making the same,” presents an innovative approach to heat dissipation. This device features an aluminum base plate with integrated studs and a folded fin design comprising inverted U-shaped heat dissipating fins connected by partitions. The innovative design ensures that thermal grease fills the gaps between components, allowing for effective heat transfer and dissipation, a crucial aspect in maintaining the performance of electronic devices.
Career Highlights: Hsien-Sheng Pei is currently associated with Foxconn Precision Component Co., Ltd., a leading corporation in the electronics manufacturing sector. His work at Foxconn highlights his commitment to advancing technology within the industry, particularly through innovations in thermal management.
Collaborations: Throughout his career, Pei has collaborated with talented professionals such as Eric Su and Stanley Chen. Their collective efforts contribute to the success and advancement of the projects they undertake, fostering an environment of innovation and excellence.
Conclusion: Hsien-Sheng Pei exemplifies the spirit of innovation through his contributions to the field of heat dissipation technology. His patent reflects a keen understanding of the requirements of modern electronics, ensuring devices operate efficiently and effectively. As he continues to work at Foxconn, his future contributions will likely further enhance the landscape of thermal management solutions.