Foxconn Precision Components Co., Ltd.

Hsien-Sheng Pei

Stanley Chen

Ken Lee

Eric Su

The present invention provides a heat dissipating device and a method for making the same. The heat dissipating device includes an aluminum flat base plate integrally forming a number of studs thereon, an aluminum folded fin with a number of inverted U-shaped heat dissipating fins connecting with each by bottom partitions. Each partition defines a number of holes. Thermal grease is uniformly spread on a bottom of each partition. In manufacturing the heat dissipating device, the folded fin is firstly mounted to the base plate to a position that the studs extend through the holes in the partitions. The studs are then subject to pressing operation to fixedly connect the folded fin and the base plate together, whereby the thermal grease entirely fill the gaps between the partitions and the base plate to enable heat absorbed by the base plate to be effectively dissipated by the inverted U-shaped heat dissipating fins.

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Taipei, Taiwan

Hsien-Sheng Pei