Chung-Ho, Taiwan

Hsien-Kun Lee



Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2000

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1 patent (USPTO):Explore Patents

Title: Innovations by Hsien-Kun Lee in Heat Sink Technology

Introduction

Hsien-Kun Lee, an innovative inventor based in Chung-Ho, Taiwan, has made a significant contribution to the field of thermal management through his patent that focuses on heat sink devices. With a wealth of knowledge and experience, he currently works for Hon Hai Precision Industry Co., Ltd., also known as Foxconn, a global leader in electronics manufacturing.

Latest Patents

Hsien-Kun Lee holds one patent titled "Method for making heat sink device and a heat sink made thereby." This innovative method involves multiple steps: first, forming a base by punching an array of mounting holes in substrates; second, creating cooling fin strips from a material sheet; third, aligning and assembling each cooling fin to the corresponding mounting holes; fourth, punching deformation holes in the first substrate to secure the cooling fins; and finally, cutting any redundant material from the cooling fin strips. This process enhances the efficiency and effectiveness of heat sink devices, crucial for various electronic applications.

Career Highlights

Lee's career at Hon Hai Precision Industry Co., Ltd. has been marked by a focus on developing advanced cooling solutions for electronic devices. His work reflects a commitment to improving heat dissipation methods, which are essential for maintaining optimal performance and longevity of electronic components.

Collaborations

Within his role, Hsien-Kun collaborates with multiple talented individuals, including his coworker Shun-Jung Lee. This teamwork is pivotal in driving innovation and enhancing productivity, as they combine their expertise to push the boundaries of technology in their field.

Conclusion

Hsien-Kun Lee's contributions to the technology of heat sinks demonstrate an impressive blend of creativity and technical skill. His patented methods not only provide solutions for current challenges in electronic device cooling but also pave the way for future innovations in thermal management. As he continues to work with Hon Hai Precision Industry, the impact of his inventions will likely resonate throughout the industry, contributing to more efficient and reliable electronic products.

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