Hsiao-Chia Lo

Title: Hsiao-Chia Lo: Innovator in Wafer Carrier Technology

Introduction

Hsiao-Chia Lo is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of wafer carrier technology, holding a total of 2 patents. His work focuses on enhancing the precision and efficiency of wafer handling systems.

Latest Patents

Among his latest patents is the "Reticle Pod Connecting Frame," which aims to improve the structural integrity and functionality of reticle pods. Another notable invention is the "Latch Guide Assembly," which is designed to be configured on the bottom of a wafer carrier. This latch guide assembly comprises a guide module with at least one guiding groove, a latch module featuring at least one side plate and at least one recess, and at least one rolling unit positioned between the guiding groove and the recess. The latch module works in conjunction with the guide module via the rolling unit, allowing for smooth movement. This innovative assembly provides a precise mechanism for locking and unlocking the wafer carrier, thereby reducing both the failure rate and dust production.

Career Highlights

Hsiao-Chia Lo is currently employed at Gudeng Precision Industrial Co., Ltd., where he continues to develop cutting-edge technologies in the semiconductor industry. His expertise and innovative mindset have positioned him as a key player in his field.

Collaborations

He has collaborated with notable colleagues, including Ming-Chien Chiu and Yung-Chin Pan, to further advance their projects and innovations.

Conclusion

Hsiao-Chia Lo's contributions to wafer carrier technology exemplify his commitment to innovation and excellence. His patents reflect a deep understanding of the industry's needs and a dedication to improving operational efficiency.