This inventor holds 1 USPTO granted patent. Top assignee: National Chung Hsing University. Active years: 2022.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2022
Title: Hsiang-Ting Wang: Innovator in Composite Materials
Introduction
Hsiang-Ting Wang is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of composite materials, particularly through his innovative patent that focuses on hollow nano-structures. His work is characterized by a blend of advanced materials science and practical applications.
Latest Patents
Hsiang-Ting Wang holds a patent for a composite with hollow nano-structures. This composite includes multiple one-dimensional hollow nanowires dispersed within a flexible polymer film. The unique properties of this composite allow for a dielectric constant that lies between that of the hollow nanowires and the polymer film, making it a valuable material for various applications.
Career Highlights
Wang is affiliated with National Chung Hsing University, where he engages in research and development in the field of materials science. His academic background and research initiatives have positioned him as a key figure in the study of composite materials.
Collaborations
Some of his notable coworkers include Tzong-Ming Wu and Fuh-Sheng Shieu. Their collaborative efforts contribute to the advancement of research in composite materials and related fields.
Conclusion
Hsiang-Ting Wang's innovative work in the development of composites with hollow nano-structures showcases his expertise and commitment to advancing materials science. His contributions are paving the way for future innovations in this important area.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile