This inventor holds 1 USPTO granted patent. Top assignee: Cooler Master Corp.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Hsiang-Fen Chou and a Heat Dissipation Structure
Introduction
Hsiang-Fen Chou is an inventor associated with New Taipei City, Taiwan, and Cooler Master Corp. Her work includes a patent for a heat dissipation structure designed to transfer heat from a heat source to a fluid.
Latest Patents
Chou is credited with 1 patent, titled “Heat Dissipation Structure.” The invention uses a heat-conductive plate that thermally contacts a heat source and a loop-shaped channel arrangement that accommodates fluid. The arrangement has connected wider and narrower channel portions. As fluid moves through the channels, it absorbs heat through the plate and may partially change phase, supporting heat dissipation.
Career Highlights
Chou’s patent reflects work on thermal management and fluid-based heat transfer. The disclosed structure combines a conductive plate with channels of differing widths to facilitate heat absorption and phase change.
Collaborations
Chou’s listed coworkers include Chi-Chuan Wang and Chang-Yu Hsieh. Her company affiliation is Cooler Master Corp.
Conclusion
Hsiang-Fen Chou’s patented heat dissipation structure combines a heat-conductive plate and a looped, variable-width channel arrangement to help transfer heat from a source to a fluid.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile