Zhongli, Taiwan

Hsi-Chun Tseng



Average Co-Inventor Count = 3.4

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2016-2017

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4 patents (USPTO):Explore Patents

Title: Hsi-Chun Tseng: Innovator in Frame Packing Technology

Introduction

Hsi-Chun Tseng is a notable inventor based in Zhongli, Taiwan. He has made significant contributions to the field of frame packing technology, holding a total of four patents. His innovative methods and systems have advanced the way color frames and depth frames are packed and unpacked for display purposes.

Latest Patents

One of Hsi-Chun Tseng's latest patents is a method, device, and system for packing a color frame and an original depth frame. This invention discloses a process to obtain a packed frame that corresponds to the original depth frame. The method includes resizing the original depth frame and combining it with the color frame to create a packed frame that is displayed on a screen. The center of the color frame is prominently displayed in the central area of the screen. Another significant patent involves an unpacking method, device, and system for the packed frame. This invention outlines the steps for extracting the color frame and resized depth frame from the packed frame and restoring the resized depth frame to its original form.

Career Highlights

Hsi-Chun Tseng has worked at National Cheng-kung University, where he has likely contributed to research and development in his field. His work has been instrumental in enhancing the technology surrounding frame packing and unpacking.

Collaborations

Throughout his career, Hsi-Chun Tseng has collaborated with notable colleagues such as Jar-Ferr Yang and Hung-Ming Wang. These collaborations have likely enriched his research and innovation efforts.

Conclusion

Hsi-Chun Tseng is a distinguished inventor whose work in frame packing technology has led to significant advancements in the field. His patents reflect a commitment to innovation and practical solutions for display technologies.

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