Company Filing History:
Years Active: 2014-2016
Title: The Innovations of How Yuan Hwang
Introduction
How Yuan Hwang is a notable inventor based in Sitiawan, Malaysia. He has made significant contributions to the field of integrated circuit packaging. With a total of 3 patents to his name, Hwang continues to push the boundaries of technology.
Latest Patents
Hwang's latest patents include the "Through via package," which describes an integrated circuit package that features an integrated circuit die in a reconstituted substrate. In this innovative design, the active side of the die is processed and then covered in molding compound while the inactive side is also processed. The molding compound on the active side is partially removed, allowing solder balls to be placed on the active side, enhancing the functionality and efficiency of the package.
Career Highlights
Hwang is currently employed at STMicroelectronics GmbH, a leading company in semiconductor solutions. His work focuses on advancing integrated circuit technologies, which are crucial for modern electronic devices. His expertise and innovative mindset have made him a valuable asset to his team.
Collaborations
Some of Hwang's notable coworkers include Kah Wee Gan and Jay Maghirang. Their collaborative efforts contribute to the success of various projects within the company.
Conclusion
How Yuan Hwang's contributions to integrated circuit packaging demonstrate his commitment to innovation in technology. His patents reflect a deep understanding of the complexities involved in electronic design, and his work continues to influence the industry.