This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2013.
Company Filing History:
Years Active: 2013
Title: Hotae Jin: Innovator in Wafer Technology
Introduction
Hotae Jin is a prominent inventor based in Cheonan, South Korea. He has made significant contributions to the field of semiconductor technology, particularly in wafer processing. His innovative approach has led to the development of a unique apparatus that enhances the efficiency of wafer division.
Latest Patents
Hotae Jin holds a patent for a wafer dividing apparatus and methods. This invention includes a chuck unit with upper and lower chucks, a cutting wire positioned between them to cut the wafer, and a first driving unit that powers the cutting wire. Additionally, the apparatus features an etchant supplying nozzle that delivers etchant to a groove formed by the cutting wire on the wafer. This patent showcases his expertise in improving semiconductor manufacturing processes.
Career Highlights
Hotae Jin is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to collaborate with other talented professionals in the field, further enhancing his skills and contributions to technology.
Collaborations
Some of Hotae Jin's notable coworkers include HeuiSeog Kim and Seonju Oh. Their collaborative efforts have played a crucial role in advancing their projects and achieving innovative solutions in wafer technology.
Conclusion
Hotae Jin's contributions to wafer technology exemplify his dedication to innovation and excellence in the semiconductor industry. His patent for the wafer dividing apparatus reflects his commitment to improving manufacturing processes.