Hoon Chang

Title: Hoon Chang and Semiconductor Chip Molding Technology.

Introduction

Hoon Chang is an inventor associated with Suwon, South Korea, and Samsung Electronics Ltd. His patent work includes a device designed to mold multiple semiconductor chips.

Latest Patents

Chang is credited with 1 patent: “Semiconductor Chip Molding Die Device.” The invention describes a die device with a lower die containing a moving plate and V-groove structures that suction a resin-coated release film. An upper die moves toward or away from the lower die to close or open the device, and suction vent units hold a substrate carrying semiconductor chips. The lower die also includes a mechanism for manually adjusting the tension of a spring supporting the moving plate.

Career Highlights

Chang’s listed patent reflects work on semiconductor manufacturing equipment, particularly die structures and film handling for molding multiple chips. He is associated with Samsung Electronics Ltd.

Collaborations

Hwansoo Lee and Minsang Park are listed as Chang’s coworkers.

Conclusion

Hoon Chang’s patent describes a semiconductor chip molding die device intended to support film suction, substrate positioning, and adjustable spring tension during the molding process.