Suwon, South Korea

Honjeong Park

This inventor holds 1 USPTO granted patent and 2 published patent applications and 1 EPO patent. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Honjeong Park. Retrieved from https://idiyas.com/inventor/honjeong-park

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

 

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Honjeong Park - Innovator in Flexible Printed Circuit Board Technology.

Introduction

Honjeong Park is an inventor based in Suwon-si, South Korea. He is known for his work in the field of flexible printed circuit boards (FPCBs). Although he currently holds no granted patents, his innovative ideas are reflected in his latest patent applications.

Latest Patent Applications

1. **MULTI-LAYERED FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISING SAME** - This application describes a multi-layered flexible printed circuit board that includes a first flexible printed circuit board (FPCB) with a first curved area for signal transmission and a bonding layer connecting it to a second FPCB.

2. **ELECTRONIC DEVICE INCLUDING STRUCTURE FOR REDUCING DAMAGE TO FLEXIBLE PRINTED CIRCUIT BOARD** - This application outlines an electronic device that features a flexible printed circuit board connecting two printed circuit boards, with a support plate and waterproof member designed to protect the FPCB.

Conclusion

Honjeong Park's contributions to the field of flexible printed circuit boards demonstrate his innovative spirit and potential for future advancements in technology. His latest patent applications reflect a commitment to improving electronic device design and functionality.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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