This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Broadcom Corporation. Active years: 2015-2016.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2015-2016
Title: Innovations of Hongyu Li
Introduction
Hongyu Li is a notable inventor based in Irvine, CA, who has made significant contributions to the field of integrated circuit packaging. With a focus on enhancing the efficiency and functionality of electronic devices, he has been awarded 2 patents for his innovative designs.
Latest Patents
One of Hongyu Li's latest patents is titled "Ball arrangement for integrated circuit package devices." This invention features an integrated circuit package that includes a ball arrangement with transmitter contact pairs arranged in a first portion of a ball grid array. Each transmitter contact pair consists of transmitter differential signal contacts, and the pairs are arranged in a staggered manner. Additionally, the ball arrangement incorporates receiver contact pairs in a second portion of the ball grid array, which also includes receiver differential signal contacts arranged in a staggered configuration. Furthermore, voltage supply contacts are strategically placed between every two pairs of transmitter and receiver contact pairs, enhancing the overall performance of the integrated circuit package.
Career Highlights
Hongyu Li is currently employed at Broadcom Corporation, a leading technology company known for its innovations in semiconductors and telecommunications. His work at Broadcom has allowed him to further develop his expertise in integrated circuit design and packaging.
Collaborations
Throughout his career, Hongyu Li has collaborated with various professionals in the field, including his coworker Arun Ramakrishnan. These collaborations have contributed to the advancement of technology and the successful development of innovative solutions.
Conclusion
Hongyu Li's contributions to integrated circuit packaging through his patents and work at Broadcom Corporation highlight his role as a significant inventor in the technology sector. His innovative designs continue to influence the development of electronic devices, showcasing the importance of creativity and engineering in modern technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile