Singapore, Singapore

Hongwei Du


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2021

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Hongwei Du

Introduction

Hongwei Du is a notable inventor based in Singapore, recognized for his contributions to the field of thermodynamics. He has developed a unique patent that addresses the challenges of heat management in electronic devices. His work is particularly relevant in today's technology-driven world, where efficient thermal management is crucial for device performance.

Latest Patents

Hongwei Du holds a patent for a thermodynamic heat exchanger. This innovative device incorporates one or more heat generating devices, a heat exchanging element, and one or more heat exhaust elements. The heat generating devices can include both active and passive electronic elements found within power conversion circuits, such as those used in power adapters for charging consumer electronics. The heat exchanging element is designed to accept radiated thermal energy from these devices and distribute it evenly across its outer surface, effectively minimizing hot spots. Additionally, it is configured to reduce heat radiation from its outer surface, enhancing the overall efficiency of thermal management.

Career Highlights

Hongwei Du is currently employed at Flextronics Ap, LLC, where he continues to innovate and contribute to advancements in electronic device design. His work at Flextronics has allowed him to apply his expertise in thermodynamics to real-world applications, further solidifying his reputation as a skilled inventor.

Collaborations

Some of his notable coworkers include Mark D Telefus and Rowell Gapuz, who collaborate with him on various projects within the company. Their combined expertise fosters a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Hongwei Du's contributions to the field of thermodynamics through his innovative patent for a thermodynamic heat exchanger exemplify the importance of effective heat management in electronic devices. His work at Flextronics and collaborations with talented colleagues further enhance his impact in the industry.

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