Beijing, China

Hongsong Tan

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Microfun Co., Ltd. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hongsong Tan. Retrieved from https://idiyas.com/inventor/hongsong-tan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Hongsong Tan: Innovator in Application Program Updating

Introduction

Hongsong Tan is a notable inventor based in Beijing, China. He has made significant contributions to the field of application program updating, showcasing his expertise through his innovative patent.

Latest Patents

Hongsong Tan holds a patent for an "Application program updating method, apparatus, system, medium and device." This invention provides a method for debugging a to-be-updated program logic through a development mode of a hot-update supporting client. It allows for the acquisition of updated program logic, which is then issued to a back-end system. The method enables front-end developers to write and update applications quickly and efficiently, without needing assistance from back-end developers.

Career Highlights

Hongsong Tan is currently employed at Microfun Co., Ltd., where he continues to innovate and develop new technologies. His work has had a significant impact on the efficiency of application development processes.

Collaborations

Hongsong has collaborated with talented coworkers, including Chi Gao and Zijian Hu, contributing to a dynamic and innovative work environment.

Conclusion

Hongsong Tan's contributions to application program updating demonstrate his commitment to advancing technology in the field. His innovative methods are paving the way for more efficient development practices in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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