This inventor holds 2 USPTO granted patents. Top assignee: Materials Resources International. Active years: 2001-2006.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2001-2006
Title: Innovations of Hongshou Zhuang in Soldering Alloys
Introduction
Hongshou Zhuang is a notable inventor based in Beijing, China. He has made significant contributions to the field of soldering alloys, with a focus on methods for joining workpieces. His innovative approaches have led to the development of two patents that enhance the efficiency and effectiveness of soldering techniques.
Latest Patents
Zhuang's latest patents include a "Method for joining workpieces using soldering alloy" and an "Alloy, in particular a solder alloy, for joining workpieces." The first patent describes a method that utilizes a solder alloy containing specific percentages of elements such as titanium, zirconium, hafnium, vanadium, niobium, tantalum, and lanthanides. This method allows for improved joining of workpieces with enhanced properties. The second patent focuses on an alloy that can be used in oxygen-containing atmospheres and at relatively low temperatures. This alloy efficiently wets difficult surfaces, such as ceramics, and can be used without flux, making it versatile for various applications.
Career Highlights
Hongshou Zhuang is associated with Materials Resources International, where he continues to innovate in the field of materials science. His work has been instrumental in advancing soldering techniques, which are crucial in various industries, including electronics and manufacturing.
Collaborations
Zhuang has collaborated with notable professionals in his field, including Wolfgang Tillmann and Erich Lugscheider. These collaborations have further enriched his research and development efforts, leading to groundbreaking advancements in soldering technology.
Conclusion
Hongshou Zhuang's contributions to soldering alloys demonstrate his commitment to innovation and excellence in materials science. His patents reflect a deep understanding of the complexities involved in joining workpieces, paving the way for future advancements in the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile