This inventor holds 1 USPTO granted patent. Top assignee: Other. Active years: 2022.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2022
Title: Innovations of Hongman Li in Software Reliability
Introduction
Hongman Li is a notable inventor based in Beijing, China. He has made significant contributions to the field of software reliability through his innovative methods. His work focuses on enhancing the analysis of software reliability using advanced technologies.
Latest Patents
Hongman Li holds a patent for a "Software reliability simulation analysis method based on virtual reality and complex network." This invention discloses a method that utilizes a two-layer network to display the coupling of a task network and a function complex network in a virtual reality environment. This approach allows technicians to observe the operation of the network from multiple perspectives. The method determines task simulation based on an operation section, enabling real-time observation of code flow and the number of passes through function nodes during task execution. It also calculates and assesses the importance of the nodes, making the task simulation method more convincing for assessing node importance.
Career Highlights
Throughout his career, Hongman Li has demonstrated a strong commitment to advancing software reliability. His innovative approach has garnered attention in the tech community, showcasing his ability to integrate virtual reality with complex network analysis.
Collaborations
Hongman Li has collaborated with notable colleagues, including Shunkun Yang and Minghao Yang. Their combined expertise contributes to the development of cutting-edge solutions in software reliability.
Conclusion
Hongman Li's contributions to software reliability through his innovative patent highlight the importance of integrating advanced technologies in analysis methods. His work continues to influence the field and inspire future innovations.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile