Shanghai, China

Hongjian (Neil) Ni

This inventor holds 3 USPTO granted patents and 5 published patent applications. Top assignee: Tyco Electronics (Shanghai) Co., Ltd.. Active years: 2023-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hongjian (Neil) Ni. Retrieved from https://idiyas.com/inventor/hongjian-neil-ni

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 3 

% Patents Active = 100.0

Average Co-Inventor Count = 2.6

ph-index = 1


Company Filing History:


Years Active: 2023-2025

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3 patents (USPTO):Explore Patents

Title: Innovations by Hongjian (Neil) Ni

Introduction

Hongjian (Neil) Ni is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of electrical engineering, particularly in connector technology. With a total of 3 patents to his name, Ni continues to push the boundaries of innovation in his industry.

Latest Patents

One of his latest patents is a plug connector socket engagement component. This invention features a plug housing with multiple side walls forming a cavity, a spacer that divides the cavity into two halves, and a series of conductive terminals. The connector engagement component allows for easy connection and disconnection from a socket connector, enhancing user convenience. Another notable patent is a connector assembly that includes a circuit board with welding pads on both sides. This design facilitates efficient wiring connections, making it a valuable advancement in connector technology.

Career Highlights

Ni is currently employed at Tyco Electronics (Shanghai) Co., Ltd., where he applies his expertise in developing innovative connector solutions. His work has been instrumental in improving the functionality and reliability of electronic connections in various applications.

Collaborations

Throughout his career, Ni has collaborated with talented individuals such as Xinjie (David) Zhang and Lizhou (Leo) Li. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Hongjian (Neil) Ni's contributions to connector technology exemplify his commitment to innovation and excellence. His patents reflect a deep understanding of engineering principles and a dedication to enhancing electronic connectivity.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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