Hongfeng Gan

Title: Innovations by Hongfeng Gan in Circuit Board Technology

Introduction

Hongfeng Gan is a notable inventor based in Zhejiang, China. He has made significant contributions to the field of circuit board technology, holding two patents that showcase his innovative approach to electronic assembly.

Latest Patents

Gan's latest patents include advancements in circuit board assembly, photosensitive assembly, and camera modules. One of his patents focuses on a circuit board assembly that integrates a photosensitive chip with a circuit board. This design features a circuit board main body with a through hole, electrical connecting terminals, and a conducting medium. The photosensitive chip is bonded to the circuit board using a non-conducting adhesive, ensuring a stable electrical connection at a low cost and with minimal process difficulty. Another patent addresses the photosensitive assembly, which includes a circuit board with a protrusion structure and a chip attachment area. This design enhances the structural strength and heat dissipation efficiency of the photosensitive chip, while also providing a manufacturing method for a camera module.

Career Highlights

Hongfeng Gan is currently employed at Ningbo Sunny Opotech Co., Ltd., where he continues to develop innovative solutions in the field of electronic components. His work has contributed to advancements in the efficiency and reliability of circuit board assemblies.

Collaborations

Gan collaborates with talented coworkers, including Zhongyu Luan and Zhen Huang, who contribute to the innovative projects at their company.

Conclusion

Hongfeng Gan's contributions to circuit board technology demonstrate his commitment to innovation and efficiency in electronic assembly. His patents reflect a deep understanding of the complexities involved in circuit design and assembly, paving the way for future advancements in the industry.