Ningbo Sunny Opotech Co., Ltd.

Hongfeng Gan

Zhen Huang

Zhongyu Luan

Li Liu

Fengsheng Xi

Xinxiang Sun

Yinbo Zhang

Tinghua Li

The present application relates to a circuit board assembly, a photosensitive assembly, a camera module, and preparation methods for the circuit board assembly and the photosensitive assembly. The photosensitive assembly includes a circuit board and a photosensitive chip. The circuit board includes a circuit board main body, a through hole formed through the circuit board main body, a set of circuit board electrical connecting terminals disposed on the lower surface of the circuit board main body, a conducting medium disposed on the circuit board electrical connecting terminals, and a non-conducting adhesive covering the conducting medium. The photosensitive chip includes chip electrical connecting terminals disposed in a non-photosensitive area. The chip electrical connecting terminals of the photosensitive chip is in contact with the conducting medium to be electrically connected to the circuit board electrical connecting terminals, and the photosensitive chip is bonded to the lower surface of the circuit board via the non-conducting adhesive, so that the photosensitive chip is electrically connected to the circuit board. In this way, the photosensitive chip is stably electrically connected to the circuit board with relatively low costs and relatively low process difficulty.

Circuit board assembly, photosensitive assembly, camera module, and preparation methods for circuit board assembly and photosensitive assembly

The present application relates to a photosensitive assembly, including a circuit board, a photosensitive chip and a metal wire. A first surface of the circuit board has a protrusion structure and a chip attachment area, and the protrusion structure is distributed in the chip attachment area. The photosensitive chip is attached to the first surface by an adhesive, and the adhesive is at least disposed between the top surface of the protrusion structure and the bottom surface of the photosensitive chip. The metal wire electrically connects the photosensitive chip and the circuit board in a wire bonding manner. The present application further provides a corresponding manufacturing method for a camera module and a photosensitive assembly. The present application can avoid or suppress the deformation of the photosensitive chip at a smaller cost of space size. The photosensitive assembly and the camera module of the present application can improve the structural strength of the circuit board. The photosensitive assembly and the camera module of the present application can improve the heat dissipation efficiency of the photosensitive chip.

Photosensitive assembly, camera module and manufacturing method thereof

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Zhejiang, China

Hongfeng Gan